Apple and Broadcom Partner to Develop AI Chip "Baltra"

Apple is collaborating with Broadcom to create a new server chip specifically designed for AI processing. Codenamed "Baltra," this chip is projected to be ready by 2026 and will be manufactured using TSMC’s enhanced 3nm process technology (N3P).

Apple's AI Focus

This partnership aligns with Apple's ongoing efforts to bolster its cloud infrastructure and AI capabilities. The company's "Project ACDC" (Apple Chips in Data Centers) aims to transition to its own silicon for cloud processing, initially using M2 Ultra chips with plans for the M4. It remains unclear whether "Baltra" will be integrated into Project ACDC, but it seems likely given its focus on AI.

Apple has prioritized on-device processing for many of its AI features. However, as these features become more complex, they require the power of cloud computing. "Baltra" could enable Apple to offer more advanced AI capabilities in the future. For more on Apple's chip strategies, see Apple to Replace Broadcom Chips with In-House Wi-Fi and Bluetooth Solution.

The Growing Importance of AI Chips

The development of specialized AI chips is gaining momentum across the tech industry. Google recently unveiled its "Willow" quantum AI chip, highlighting the increasing demand for powerful AI hardware. This trend underscores the significance of Apple's investment in "Baltra." To learn more about the latest advancements in AI, check out ChatGPT's 2024: A Year of AI Advancements and Challenges.

Apple and Broadcom's Continued Collaboration

The "Baltra" project builds upon a long-standing relationship between Apple and Broadcom. The companies are also working together on RF filters for Apple's in-house 5G modem, expected to debut in the 2025 iPhone SE. This ongoing collaboration demonstrates the strategic importance of their partnership. For insights into Apple's future plans, see Apple's 2025 Roadmap: Home Devices, Cellular Macs, and Vision Pro Enhancements.